Global Chip Encapsulation Material Market Size, Manufacturers, Opportunities and Forecast to 2030

Global Chip Encapsulation Material Market Size, Manufacturers, Opportunities and Forecast to 2030


Summary

According to APO Research, The global Chip Encapsulation Material market was estimated at US$ million in 2023 and is projected to reach a revised size of US$ million by 2030, witnessing a CAGR of xx% during the forecast period 2024-2030.

North American market for Chip Encapsulation Material is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.

Asia-Pacific market for Chip Encapsulation Material is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.

Europe market for Chip Encapsulation Material is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.

The major global manufacturers of Chip Encapsulation Material include Sumitomo Bakelite, Chang Wah Technology, Xingsen Technology, Tanaka, Panasonic, Shennan Circuit Company Limited, Mitsui High-tec, Inc., Kangqiang Electronics and Kyocera, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Chip Encapsulation Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Encapsulation Material.

The Chip Encapsulation Material market size, estimations, and forecasts are provided in terms of sales volume (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Chip Encapsulation Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided. For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

Key Companies & Market Share Insights

In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2019-2024. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:

Sumitomo Bakelite
Chang Wah Technology
Xingsen Technology
Tanaka
Panasonic
Shennan Circuit Company Limited
Mitsui High-tec, Inc.
Kangqiang Electronics
Kyocera
Heraeus
Henkel

Chip Encapsulation Material segment by Type

Substrates
Encapsulating Resin
Bonding Wires
Lead Frame
Others

Chip Encapsulation Material segment by Application

IT and Communication Industry
Automotive Electronics
Consumer Electronics
Others

Chip Encapsulation Material Segment by Region

North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Netherlands
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Southeast Asia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE

Key Drivers & Barriers

High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.

Reasons to Buy This Report

1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Chip Encapsulation Material market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Chip Encapsulation Material and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Chip Encapsulation Material.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.

Chapter Outline

Chapter 1: Introduces the study scope of this report, executive summary of market segments by type, market size segments for North America, Europe, Asia Pacific, Latin America, Middle East & Africa.
Chapter 2: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Encapsulation Material manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Sales, revenue of Chip Encapsulation Material in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter 5: Introduces market segments by application, market size segment for North America, Europe, Asia Pacific, Latin America, Middle East & Africa.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 7, 8, 9, 10 and 11: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, sales and revenue by country.
Chapter 12: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics.
Chapter 13: Concluding Insights of the report.


1 Market Overview
1.1 Product Definition
1.2 Global Market Growth Prospects
1.2.1 Global Chip Encapsulation Material Market Size Estimates and Forecasts (2019-2030)
1.2.2 Global Chip Encapsulation Material Sales Estimates and Forecasts (2019-2030)
1.3 Chip Encapsulation Material Market by Type
1.3.1 Substrates
1.3.2 Encapsulating Resin
1.3.3 Bonding Wires
1.3.4 Lead Frame
1.3.5 Others
1.4 Global Chip Encapsulation Material Market Size by Type
1.4.1 Global Chip Encapsulation Material Market Size Overview by Type (2019-2030)
1.4.2 Global Chip Encapsulation Material Historic Market Size Review by Type (2019-2024)
1.4.3 Global Chip Encapsulation Material Forecasted Market Size by Type (2025-2030)
1.5 Key Regions Market Size by Type
1.5.1 North America Chip Encapsulation Material Sales Breakdown by Type (2019-2024)
1.5.2 Europe Chip Encapsulation Material Sales Breakdown by Type (2019-2024)
1.5.3 Asia-Pacific Chip Encapsulation Material Sales Breakdown by Type (2019-2024)
1.5.4 Latin America Chip Encapsulation Material Sales Breakdown by Type (2019-2024)
1.5.5 Middle East and Africa Chip Encapsulation Material Sales Breakdown by Type (2019-2024)
2 Global Market Dynamics
2.1 Chip Encapsulation Material Industry Trends
2.2 Chip Encapsulation Material Industry Drivers
2.3 Chip Encapsulation Material Industry Opportunities and Challenges
2.4 Chip Encapsulation Material Industry Restraints
3 Market Competitive Landscape by Company
3.1 Global Top Players by Chip Encapsulation Material Revenue (2019-2024)
3.2 Global Top Players by Chip Encapsulation Material Sales (2019-2024)
3.3 Global Top Players by Chip Encapsulation Material Price (2019-2024)
3.4 Global Chip Encapsulation Material Industry Company Ranking, 2022 VS 2023 VS 2024
3.5 Global Chip Encapsulation Material Key Company Manufacturing Sites & Headquarters
3.6 Global Chip Encapsulation Material Company, Product Type & Application
3.7 Global Chip Encapsulation Material Company Commercialization Time
3.8 Market Competitive Analysis
3.8.1 Global Chip Encapsulation Material Market CR5 and HHI
3.8.2 Global Top 5 and 10 Chip Encapsulation Material Players Market Share by Revenue in 2023
3.8.3 2023 Chip Encapsulation Material Tier 1, Tier 2, and Tier 3
4 Chip Encapsulation Material Regional Status and Outlook
4.1 Global Chip Encapsulation Material Market Size and CAGR by Region: 2019 VS 2023 VS 2030
4.2 Global Chip Encapsulation Material Historic Market Size by Region
4.2.1 Global Chip Encapsulation Material Sales in Volume by Region (2019-2024)
4.2.2 Global Chip Encapsulation Material Sales in Value by Region (2019-2024)
4.2.3 Global Chip Encapsulation Material Sales (Volume & Value), Price and Gross Margin (2019-2024)
4.3 Global Chip Encapsulation Material Forecasted Market Size by Region
4.3.1 Global Chip Encapsulation Material Sales in Volume by Region (2025-2030)
4.3.2 Global Chip Encapsulation Material Sales in Value by Region (2025-2030)
4.3.3 Global Chip Encapsulation Material Sales (Volume & Value), Price and Gross Margin (2025-2030)
5 Chip Encapsulation Material by Application
5.1 Chip Encapsulation Material Market by Application
5.1.1 IT and Communication Industry
5.1.2 Automotive Electronics
5.1.3 Consumer Electronics
5.1.4 Others
5.2 Global Chip Encapsulation Material Market Size by Application
5.2.1 Global Chip Encapsulation Material Market Size Overview by Application (2019-2030)
5.2.2 Global Chip Encapsulation Material Historic Market Size Review by Application (2019-2024)
5.2.3 Global Chip Encapsulation Material Forecasted Market Size by Application (2025-2030)
5.3 Key Regions Market Size by Application
5.3.1 North America Chip Encapsulation Material Sales Breakdown by Application (2019-2024)
5.3.2 Europe Chip Encapsulation Material Sales Breakdown by Application (2019-2024)
5.3.3 Asia-Pacific Chip Encapsulation Material Sales Breakdown by Application (2019-2024)
5.3.4 Latin America Chip Encapsulation Material Sales Breakdown by Application (2019-2024)
5.3.5 Middle East and Africa Chip Encapsulation Material Sales Breakdown by Application (2019-2024)
6 Company Profiles
6.1 Sumitomo Bakelite
6.1.1 Sumitomo Bakelite Comapny Information
6.1.2 Sumitomo Bakelite Business Overview
6.1.3 Sumitomo Bakelite Chip Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
6.1.4 Sumitomo Bakelite Chip Encapsulation Material Product Portfolio
6.1.5 Sumitomo Bakelite Recent Developments
6.2 Chang Wah Technology
6.2.1 Chang Wah Technology Comapny Information
6.2.2 Chang Wah Technology Business Overview
6.2.3 Chang Wah Technology Chip Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
6.2.4 Chang Wah Technology Chip Encapsulation Material Product Portfolio
6.2.5 Chang Wah Technology Recent Developments
6.3 Xingsen Technology
6.3.1 Xingsen Technology Comapny Information
6.3.2 Xingsen Technology Business Overview
6.3.3 Xingsen Technology Chip Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
6.3.4 Xingsen Technology Chip Encapsulation Material Product Portfolio
6.3.5 Xingsen Technology Recent Developments
6.4 Tanaka
6.4.1 Tanaka Comapny Information
6.4.2 Tanaka Business Overview
6.4.3 Tanaka Chip Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
6.4.4 Tanaka Chip Encapsulation Material Product Portfolio
6.4.5 Tanaka Recent Developments
6.5 Panasonic
6.5.1 Panasonic Comapny Information
6.5.2 Panasonic Business Overview
6.5.3 Panasonic Chip Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
6.5.4 Panasonic Chip Encapsulation Material Product Portfolio
6.5.5 Panasonic Recent Developments
6.6 Shennan Circuit Company Limited
6.6.1 Shennan Circuit Company Limited Comapny Information
6.6.2 Shennan Circuit Company Limited Business Overview
6.6.3 Shennan Circuit Company Limited Chip Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
6.6.4 Shennan Circuit Company Limited Chip Encapsulation Material Product Portfolio
6.6.5 Shennan Circuit Company Limited Recent Developments
6.7 Mitsui High-tec, Inc.
6.7.1 Mitsui High-tec, Inc. Comapny Information
6.7.2 Mitsui High-tec, Inc. Business Overview
6.7.3 Mitsui High-tec, Inc. Chip Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
6.7.4 Mitsui High-tec, Inc. Chip Encapsulation Material Product Portfolio
6.7.5 Mitsui High-tec, Inc. Recent Developments
6.8 Kangqiang Electronics
6.8.1 Kangqiang Electronics Comapny Information
6.8.2 Kangqiang Electronics Business Overview
6.8.3 Kangqiang Electronics Chip Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
6.8.4 Kangqiang Electronics Chip Encapsulation Material Product Portfolio
6.8.5 Kangqiang Electronics Recent Developments
6.9 Kyocera
6.9.1 Kyocera Comapny Information
6.9.2 Kyocera Business Overview
6.9.3 Kyocera Chip Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
6.9.4 Kyocera Chip Encapsulation Material Product Portfolio
6.9.5 Kyocera Recent Developments
6.10 Heraeus
6.10.1 Heraeus Comapny Information
6.10.2 Heraeus Business Overview
6.10.3 Heraeus Chip Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
6.10.4 Heraeus Chip Encapsulation Material Product Portfolio
6.10.5 Heraeus Recent Developments
6.11 Henkel
6.11.1 Henkel Comapny Information
6.11.2 Henkel Business Overview
6.11.3 Henkel Chip Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
6.11.4 Henkel Chip Encapsulation Material Product Portfolio
6.11.5 Henkel Recent Developments
7 North America by Country
7.1 North America Chip Encapsulation Material Sales by Country
7.1.1 North America Chip Encapsulation Material Sales Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
7.1.2 North America Chip Encapsulation Material Sales by Country (2019-2024)
7.1.3 North America Chip Encapsulation Material Sales Forecast by Country (2025-2030)
7.2 North America Chip Encapsulation Material Market Size by Country
7.2.1 North America Chip Encapsulation Material Market Size Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
7.2.2 North America Chip Encapsulation Material Market Size by Country (2019-2024)
7.2.3 North America Chip Encapsulation Material Market Size Forecast by Country (2025-2030)
8 Europe by Country
8.1 Europe Chip Encapsulation Material Sales by Country
8.1.1 Europe Chip Encapsulation Material Sales Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
8.1.2 Europe Chip Encapsulation Material Sales by Country (2019-2024)
8.1.3 Europe Chip Encapsulation Material Sales Forecast by Country (2025-2030)
8.2 Europe Chip Encapsulation Material Market Size by Country
8.2.1 Europe Chip Encapsulation Material Market Size Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
8.2.2 Europe Chip Encapsulation Material Market Size by Country (2019-2024)
8.2.3 Europe Chip Encapsulation Material Market Size Forecast by Country (2025-2030)
9 Asia-Pacific by Country
9.1 Asia-Pacific Chip Encapsulation Material Sales by Country
9.1.1 Asia-Pacific Chip Encapsulation Material Sales Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
9.1.2 Asia-Pacific Chip Encapsulation Material Sales by Country (2019-2024)
9.1.3 Asia-Pacific Chip Encapsulation Material Sales Forecast by Country (2025-2030)
9.2 Asia-Pacific Chip Encapsulation Material Market Size by Country
9.2.1 Asia-Pacific Chip Encapsulation Material Market Size Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
9.2.2 Asia-Pacific Chip Encapsulation Material Market Size by Country (2019-2024)
9.2.3 Asia-Pacific Chip Encapsulation Material Market Size Forecast by Country (2025-2030)
10 Latin America by Country
10.1 Latin America Chip Encapsulation Material Sales by Country
10.1.1 Latin America Chip Encapsulation Material Sales Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
10.1.2 Latin America Chip Encapsulation Material Sales by Country (2019-2024)
10.1.3 Latin America Chip Encapsulation Material Sales Forecast by Country (2025-2030)
10.2 Latin America Chip Encapsulation Material Market Size by Country
10.2.1 Latin America Chip Encapsulation Material Market Size Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
10.2.2 Latin America Chip Encapsulation Material Market Size by Country (2019-2024)
10.2.3 Latin America Chip Encapsulation Material Market Size Forecast by Country (2025-2030)
11 Middle East and Africa by Country
11.1 Middle East and Africa Chip Encapsulation Material Sales by Country
11.1.1 Middle East and Africa Chip Encapsulation Material Sales Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
11.1.2 Middle East and Africa Chip Encapsulation Material Sales by Country (2019-2024)
11.1.3 Middle East and Africa Chip Encapsulation Material Sales Forecast by Country (2025-2030)
11.2 Middle East and Africa Chip Encapsulation Material Market Size by Country
11.2.1 Middle East and Africa Chip Encapsulation Material Market Size Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
11.2.2 Middle East and Africa Chip Encapsulation Material Market Size by Country (2019-2024)
11.2.3 Middle East and Africa Chip Encapsulation Material Market Size Forecast by Country (2025-2030)
12 Value Chain and Sales Channels Analysis
12.1 Chip Encapsulation Material Value Chain Analysis
12.1.1 Chip Encapsulation Material Key Raw Materials
12.1.2 Key Raw Materials Price
12.1.3 Raw Materials Key Suppliers
12.1.4 Manufacturing Cost Structure
12.1.5 Chip Encapsulation Material Production Mode & Process
12.2 Chip Encapsulation Material Sales Channels Analysis
12.2.1 Direct Comparison with Distribution Share
12.2.2 Chip Encapsulation Material Distributors
12.2.3 Chip Encapsulation Material Customers
13 Concluding Insights
14 Appendix
14.1 Reasons for Doing This Study
14.2 Research Methodology
14.3 Research Process
14.4 Authors List of This Report
14.5 Data Source
14.5.1 Secondary Sources
14.5.2 Primary Sources
14.6 Disclaimer

Download our eBook: How to Succeed Using Market Research

Learn how to effectively navigate the market research process to help guide your organization on the journey to success.

Download eBook
Cookie Settings