Through Glass Via (TGV) Wafer Industry Research Report 2025

Summary

Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).

According to APO Research, The global Through Glass Via (TGV) Wafer market was valued at US$ million in 2024 and is anticipated to reach US$ million by 2031, witnessing a CAGR of xx% during the forecast period 2025-2031.

North American market for Through Glass Via (TGV) Wafer is estimated to increase from $ million in 2025 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

Asia-Pacific market for Through Glass Via (TGV) Wafer is estimated to increase from $ million in 2025 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

Europe market for Through Glass Via (TGV) Wafer is estimated to increase from $ million in 2025 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

The major global companies of Through Glass Via (TGV) Wafer include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia. etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Through Glass Via (TGV) Wafer, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through Glass Via (TGV) Wafer.
The Through Glass Via (TGV) Wafer market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Through Glass Via (TGV) Wafer market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided. For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

Key Companies & Market Share Insights

In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2020-2025. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses.

Through Glass Via (TGV) Wafer Segment by Company

Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia
Through Glass Via (TGV) Wafer Segment by Type

300 mm
200 mm
Below150 mm
Through Glass Via (TGV) Wafer Segment by Application

Biotechnology/Medical
Consumer Electronics
Automotive
Others
Through Glass Via (TGV) Wafer Segment by Application

Biotechnology/Medical
Consumer Electronics
Automotive
Others
Through Glass Via (TGV) Wafer Segment by Region

North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Spain
Russia
Netherlands
Nordic Countries
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Saudi Arabia
Israel
United Arab Emirates
Turkey
Iran
Egypt

Key Drivers & Barriers

High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.

Reasons to Buy This Report

1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Through Glass Via (TGV) Wafer market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Through Glass Via (TGV) Wafer and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Through Glass Via (TGV) Wafer.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.

Chapter Outline

Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Provides the analysis of various market segments product types, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 6: Detailed analysis of Through Glass Via (TGV) Wafer companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 7, 8, 9, 10, 11: North America, Europe, Asia Pacific, South America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 12: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including revenue, gross margin, product introduction, recent development, etc.
Chapter 13: The main points and conclusions of the report.

Please Note: Single-User license will be delivered via PDF from the publisher without the rights to print or to edit.


1 Preface
1.1 Scope of Report
1.2 Reasons for Doing This Study
1.3 Research Methodology
1.4 Research Process
1.5 Data Source
1.5.1 Secondary Sources
1.5.2 Primary Sources
2 Market Overview
2.1 Product Definition
2.2 Through Glass Via (TGV) Wafer by Type
2.2.1 Market Value Comparison by Type (2020 VS 2024 VS 2031)
2.2.2 300 mm
2.2.3 200 mm
2.2.4 Below150 mm
2.3 Through Glass Via (TGV) Wafer by Application
2.3.1 Market Value Comparison by Application (2020 VS 2024 VS 2031)
2.3.2 Biotechnology/Medical
2.3.3 Consumer Electronics
2.3.4 Automotive
2.3.5 Others
2.4 Assumptions and Limitations
3 Through Glass Via (TGV) Wafer Breakdown Data by Type
3.1 Global Through Glass Via (TGV) Wafer Historic Market Size by Type (2020-2025)
3.2 Global Through Glass Via (TGV) Wafer Forecasted Market Size by Type (2026-2031)
4 Through Glass Via (TGV) Wafer Breakdown Data by Application
4.1 Global Through Glass Via (TGV) Wafer Historic Market Size by Application (2020-2025)
4.2 Global Through Glass Via (TGV) Wafer Forecasted Market Size by Application (2026-2031)
5 Global Growth Trends
5.1 Global Through Glass Via (TGV) Wafer Market Perspective (2020-2031)
5.2 Global Through Glass Via (TGV) Wafer Growth Trends by Region
5.2.1 Global Through Glass Via (TGV) Wafer Market Size by Region: 2020 VS 2024 VS 2031
5.2.2 Through Glass Via (TGV) Wafer Historic Market Size by Region (2020-2025)
5.2.3 Through Glass Via (TGV) Wafer Forecasted Market Size by Region (2026-2031)
5.3 Through Glass Via (TGV) Wafer Market Dynamics
5.3.1 Through Glass Via (TGV) Wafer Industry Trends
5.3.2 Through Glass Via (TGV) Wafer Market Drivers
5.3.3 Through Glass Via (TGV) Wafer Market Challenges
5.3.4 Through Glass Via (TGV) Wafer Market Restraints
6 Market Competitive Landscape by Players
6.1 Global Top Through Glass Via (TGV) Wafer Players by Revenue
6.1.1 Global Top Through Glass Via (TGV) Wafer Players by Revenue (2020-2025)
6.1.2 Global Through Glass Via (TGV) Wafer Revenue Market Share by Players (2020-2025)
6.2 Global Through Glass Via (TGV) Wafer Industry Players Ranking, 2023 VS 2024 VS 2025
6.3 Global Key Players of Through Glass Via (TGV) Wafer Head Office and Area Served
6.4 Global Through Glass Via (TGV) Wafer Players, Product Type & Application
6.5 Global Through Glass Via (TGV) Wafer Manufacturers Established Date
6.6 Global Through Glass Via (TGV) Wafer Market CR5 and HHI
6.7 Global Players Mergers & Acquisition
7 North America
7.1 North America Through Glass Via (TGV) Wafer Market Size (2020-2031)
7.2 North America Through Glass Via (TGV) Wafer Market Growth Rate by Country: 2020 VS 2024 VS 2031
7.3 North America Through Glass Via (TGV) Wafer Market Size by Country (2020-2025)
7.4 North America Through Glass Via (TGV) Wafer Market Size by Country (2026-2031)
7.5 United States
7.5 United States
7.6 Canada
7.7 Mexico
8 Europe
8.1 Europe Through Glass Via (TGV) Wafer Market Size (2020-2031)
8.2 Europe Through Glass Via (TGV) Wafer Market Growth Rate by Country: 2020 VS 2024 VS 2031
8.3 Europe Through Glass Via (TGV) Wafer Market Size by Country (2020-2025)
8.4 Europe Through Glass Via (TGV) Wafer Market Size by Country (2026-2031)
8.5 Germany
8.6 France
8.7 U.K.
8.8 Italy
8.9 Spain
8.10 Russia
8.11 Netherlands
8.12 Nordic Countries
9 Asia-Pacific
9.1 Asia-Pacific Through Glass Via (TGV) Wafer Market Size (2020-2031)
9.2 Asia-Pacific Through Glass Via (TGV) Wafer Market Growth Rate by Country: 2020 VS 2024 VS 2031
9.3 Asia-Pacific Through Glass Via (TGV) Wafer Market Size by Country (2020-2025)
9.4 Asia-Pacific Through Glass Via (TGV) Wafer Market Size by Country (2026-2031)
9.5 China
9.6 Japan
9.7 South Korea
9.8 India
9.9 Australia
9.10 China Taiwan
9.11 Southeast Asia
10 South America
10.1 South America Through Glass Via (TGV) Wafer Market Size (2020-2031)
10.2 South America Through Glass Via (TGV) Wafer Market Growth Rate by Country: 2020 VS 2024 VS 2031
10.3 South America Through Glass Via (TGV) Wafer Market Size by Country (2020-2025)
10.4 South America Through Glass Via (TGV) Wafer Market Size by Country (2026-2031)
10.5 Brazil
10.6 Argentina
10.7 Chile
10.8 Colombia
10.9 Peru
11 Middle East & Africa
11.1 Middle East & Africa Through Glass Via (TGV) Wafer Market Size (2020-2031)
11.2 Middle East & Africa Through Glass Via (TGV) Wafer Market Growth Rate by Country: 2020 VS 2024 VS 2031
11.3 Middle East & Africa Through Glass Via (TGV) Wafer Market Size by Country (2020-2025)
11.4 Middle East & Africa Through Glass Via (TGV) Wafer Market Size by Country (2026-2031)
11.5 Saudi Arabia
11.6 Israel
11.7 United Arab Emirates
11.8 Turkey
11.9 Iran
11.10 Egypt
12 Players Profiled
12.1 Corning
12.1.1 Corning Company Information
12.1.2 Corning Business Overview
12.1.3 Corning Revenue in Through Glass Via (TGV) Wafer Business (2020-2025)
12.1.4 Corning Through Glass Via (TGV) Wafer Product Portfolio
12.1.5 Corning Recent Developments
12.2 LPKF
12.2.1 LPKF Company Information
12.2.2 LPKF Business Overview
12.2.3 LPKF Revenue in Through Glass Via (TGV) Wafer Business (2020-2025)
12.2.4 LPKF Through Glass Via (TGV) Wafer Product Portfolio
12.2.5 LPKF Recent Developments
12.3 Samtec
12.3.1 Samtec Company Information
12.3.2 Samtec Business Overview
12.3.3 Samtec Revenue in Through Glass Via (TGV) Wafer Business (2020-2025)
12.3.4 Samtec Through Glass Via (TGV) Wafer Product Portfolio
12.3.5 Samtec Recent Developments
12.4 Kiso Micro Co.LTD
12.4.1 Kiso Micro Co.LTD Company Information
12.4.2 Kiso Micro Co.LTD Business Overview
12.4.3 Kiso Micro Co.LTD Revenue in Through Glass Via (TGV) Wafer Business (2020-2025)
12.4.4 Kiso Micro Co.LTD Through Glass Via (TGV) Wafer Product Portfolio
12.4.5 Kiso Micro Co.LTD Recent Developments
12.5 Tecnisco
12.5.1 Tecnisco Company Information
12.5.2 Tecnisco Business Overview
12.5.3 Tecnisco Revenue in Through Glass Via (TGV) Wafer Business (2020-2025)
12.5.4 Tecnisco Through Glass Via (TGV) Wafer Product Portfolio
12.5.5 Tecnisco Recent Developments
12.6 Microplex
12.6.1 Microplex Company Information
12.6.2 Microplex Business Overview
12.6.3 Microplex Revenue in Through Glass Via (TGV) Wafer Business (2020-2025)
12.6.4 Microplex Through Glass Via (TGV) Wafer Product Portfolio
12.6.5 Microplex Recent Developments
12.7 Plan Optik
12.7.1 Plan Optik Company Information
12.7.2 Plan Optik Business Overview
12.7.3 Plan Optik Revenue in Through Glass Via (TGV) Wafer Business (2020-2025)
12.7.4 Plan Optik Through Glass Via (TGV) Wafer Product Portfolio
12.7.5 Plan Optik Recent Developments
12.8 NSG Group
12.8.1 NSG Group Company Information
12.8.2 NSG Group Business Overview
12.8.3 NSG Group Revenue in Through Glass Via (TGV) Wafer Business (2020-2025)
12.8.4 NSG Group Through Glass Via (TGV) Wafer Product Portfolio
12.8.5 NSG Group Recent Developments
12.9 Allvia
12.9.1 Allvia Company Information
12.9.2 Allvia Business Overview
12.9.3 Allvia Revenue in Through Glass Via (TGV) Wafer Business (2020-2025)
12.9.4 Allvia Through Glass Via (TGV) Wafer Product Portfolio
12.9.5 Allvia Recent Developments
13 Report Conclusion
14 Disclaimer

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