Radiation-Hardened Electronics Market by Component (Application Specific Integrated Circuit, Field Programmable Gate Arrays), Manufacturing Technique (Radiation Hardening by Design, Radiation Hardening by Process), Application - Global Forecast 2024-2030

Radiation-Hardened Electronics Market by Component (Application Specific Integrated Circuit, Field Programmable Gate Arrays), Manufacturing Technique (Radiation Hardening by Design, Radiation Hardening by Process), Application - Global Forecast 2024-2030


The Radiation-Hardened Electronics Market size was estimated at USD 1.63 billion in 2023 and expected to reach USD 1.70 billion in 2024, at a CAGR 4.39% to reach USD 2.20 billion by 2030.

Radiation-hardened electronics are specialized electronic components and systems designed to withstand the damaging environments of high levels of ionizing radiation. These types of electronics are crucial in intense radiation environments, such as outer space, nuclear reactors, and high-altitude flight. The hardening process involves selecting materials that are less susceptible to radiation damage and applying design techniques that mitigate the effects of radiation on the electronic device. The objective is to ensure the reliable operation of electronic systems in hostile radioactive environments without succumbing to radiation-induced failures, such as changes in semiconductor properties or the disruption of electronic circuit functionalities. The primary factors driving the demand for radiation-hardened electronics are increased space exploration missions and satellite launches. Governments and private companies worldwide are investing heavily in space research and satellite communication infrastructure, driving the demand for electronics that can withstand space's harsh radiation environment. However, radiation-hardened electronics involve complex technology that requires advanced design and fabrication techniques. Integrating these robust components with existing systems poses significant challenges, impacting their adoption rate across various industries. Moreover, military modernization programs across the globe boost the adoption of radiation-hardened electronics. Modern defense platforms, including unmanned systems, satellites, and missile systems, require components that can survive and function in nuclear environments or space, significantly creating an avenue for radiation-hardened electronic manufacturers and suppliers.

Regional Insights

The Americas holds a significant position in the radiation-hardened electronics market, fueled by its robust aerospace and defense sectors. The increasing deployment of satellites, space exploration missions by NASA, and the growing need for secure military communication systems drive the demand. Recent patents in this region emphasize novel materials and manufacturing processes to enhance the radiation tolerance of electronics. Investments and initiatives are largely propelled by the government and aerospace corporations, aiming to strengthen national security and space exploration capabilities. At the same time, the EMEA, with its collaborative space initiatives and advanced defense mechanisms, has a substantial need for radiation-hardened electronics. The European Space Agency (ESA) plays a pivotal role in driving demand through its missions and research. EU funding often supports innovation and research in the region, focusing on enhancing the resilience and efficiency of space electronics. Moreover, the Asia-Pacific region is witnessing a significant surge in the demand for radiation-hardened electronics, attributed to the expanding space exploration initiatives and the increasing deployment of defense satellites. This burgeoning demand in the region fosters innovation and development, inviting international and regional players to invest in research and development activities.

Market Insights

Market Dynamics

The market dynamics represent an ever-changing landscape of the Radiation-Hardened Electronics Market by providing actionable insights into factors, including supply and demand levels. Accounting for these factors helps design strategies, make investments, and formulate developments to capitalize on future opportunities. In addition, these factors assist in avoiding potential pitfalls related to political, geographical, technical, social, and economic conditions, highlighting consumer behaviors and influencing manufacturing costs and purchasing decisions.

Market Drivers

Increasing surveillance, intelligence, and reconnaissance (ISR) operations globally
The increase in space exploration missions and satellite launches
Establishment of autonomous military operations in a hostile environment

Market Restraints

High cost associated with the development and manufacturing of radiation-hardened electronic components

Market Opportunities

Technological advancements in military defense equipment and the need for sophisticated radiation-hardened electronics
Increasing governments and commercial investment activities in space research and satellite communication infrastructure

Market Challenges

The complexity associated with the design and testing processes of Rad-hard electronics components

Market Segmentation Analysis

Manufacturing Technique: Utilization of RHBD techniques in electronics to ensure their dependability and efficacy
Application: Increasing usage of radiation-hardened electronics in nuclear settings to tackle the harsh environmental conditions

Market Disruption Analysis

Porter’s Five Forces Analysis
Value Chain & Critical Path Analysis
Pricing Analysis
Technology Analysis
Patent Analysis
Trade Analysis
Regulatory Framework Analysis

FPNV Positioning Matrix

The FPNV positioning matrix is essential in evaluating the market positioning of the vendors in the Radiation-Hardened Electronics Market. This matrix offers a comprehensive assessment of vendors, examining critical metrics related to business strategy and product satisfaction. This in-depth assessment empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success, namely Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The market share analysis is a comprehensive tool that provides an insightful and in-depth assessment of the current state of vendors in the Radiation-Hardened Electronics Market. By meticulously comparing and analyzing vendor contributions, companies are offered a greater understanding of their performance and the challenges they face when competing for market share. These contributions include overall revenue, customer base, and other vital metrics. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With these illustrative details, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Recent Developments

EPC Space Launches First Rad Hard GaN Power Stage IC

EPC Space launched the EPC7011L7SH, a radiation-hardened GaN power stage integrated circuit (IC) tailored for space applications. This innovative device, encapsulated in a compact aluminum nitride (AlN) ceramic surface mount package, marries a 50V, 6A capability with a single-chip solution that ingeniously combines a driver and an eGaN FET half-bridge power stage. It is designed for exceptional performance and boasts a high-speed switching capacity exceeding 2 MHz, asserting itself as a pivotal advancement in space-grade power electronics.

Crane A&E Launches New Interpoint xMOR Product Family

Crane Aerospace & Electronics launched the 120W Interpoint xMOR family of power conversion solutions, marking a significant advancement in radiation-hardened electronics. This innovative product line includes the sMOR, specifically engineered for deep-space missions, boasting Class K certification alongside remarkable performance within a 19-50V input range. Additionally, the lineup introduces the rMOR, which is tailored to meet the escalating demands of the burgeoning New Space sector. With these offerings, Crane A&E sets a new standard in power conversion technology, reinforcing its commitment to innovation and reliability in the aerospace industry.

Zero-Error Systems Raises USD 7.5 Million for its Radiation-Hardened Semiconductor Integrated Circuits

Zero-Error Systems (ZES) secured USD 7.5 million in funding to advance its radiation-hardened semiconductor integrated circuits technology. This infusion of capital is set to bolster ZES's capabilities in producing state-of-the-art components that are highly resistant to the detrimental effects of radiation. The funding underscores the confidence in ZES's innovative approach to enhancing the reliability and longevity of critical systems deployed in challenging conditions, marking an important milestone in the quest for robust and failsafe electronic systems in aerospace and defense applications.

Strategy Analysis & Recommendation

The strategic analysis is essential for organizations seeking a solid foothold in the global marketplace. Companies are better positioned to make informed decisions that align with their long-term aspirations by thoroughly evaluating their current standing in the Radiation-Hardened Electronics Market. This critical assessment involves a thorough analysis of the organization’s resources, capabilities, and overall performance to identify its core strengths and areas for improvement.

Key Company Profiles

The report delves into recent significant developments in the Radiation-Hardened Electronics Market, highlighting leading vendors and their innovative profiles. These include Advanced Micro Devices, Inc., Analog Devices, Inc, BAE Systems PLC, Cobham Limited, Crane Aerospace & Electronics, Data Device Corporation, GSI Technology Inc., Honeywell International Inc., Infineon Technologies AG, Mercury Systems, Inc., Microchip Technology Inc., Micross, On Semiconductor Corporation, PCB Piezotronics, Inc., Renesas Electronics Corporation, Silicon Laboratories Inc., STMicroelectronics NV, Teledyne Technologies Inc., Texas Instruments Incorporated, TTM Technologies, Inc., and Vorago Technologies.

Market Segmentation & Coverage

This research report categorizes the Radiation-Hardened Electronics Market to forecast the revenues and analyze trends in each of the following sub-markets:

Component
Application Specific Integrated Circuit
Field Programmable Gate Arrays
Manufacturing Technique
Radiation Hardening by Design
Radiation Hardening by Process
Application
Aerospace & Defense
Nuclear Power Plant
Space or Satellite
Region
Americas
Argentina
Brazil
Canada
Mexico
United States
California
Florida
Illinois
New York
Ohio
Pennsylvania
Texas
Asia-Pacific
Australia
China
India
Indonesia
Japan
Malaysia
Philippines
Singapore
South Korea
Taiwan
Thailand
Vietnam
Europe, Middle East & Africa
Denmark
Egypt
Finland
France
Germany
Israel
Italy
Netherlands
Nigeria
Norway
Poland
Qatar
Russia
Saudi Arabia
South Africa
Spain
Sweden
Switzerland
Turkey
United Arab Emirates
United Kingdom

Please Note: PDF & Excel + Online Access - 1 Year


1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Increasing surveillance, intelligence, and reconnaissance (ISR) operations globally
5.1.1.2. The increase in space exploration missions and satellite launches
5.1.1.3. Establishment of autonomous military operations in a hostile environment
5.1.2. Restraints
5.1.2.1. High cost associated with the development and manufacturing of radiation-hardened electronic components
5.1.3. Opportunities
5.1.3.1. Technological advancements in military defense equipment and the need for sophisticated radiation-hardened electronics
5.1.3.2. Increasing governments and commercial investment activities in space research and satellite communication infrastructure
5.1.4. Challenges
5.1.4.1. The complexity associated with the design and testing processes of Rad-hard electronics components
5.2. Market Segmentation Analysis
5.2.1. Manufacturing Technique: Utilization of RHBD techniques in electronics to ensure their dependability and efficacy
5.2.2. Application: Increasing usage of radiation-hardened electronics in nuclear settings to tackle the harsh environmental conditions
5.3. Market Disruption Analysis
5.4. Porter’s Five Forces Analysis
5.4.1. Threat of New Entrants
5.4.2. Threat of Substitutes
5.4.3. Bargaining Power of Customers
5.4.4. Bargaining Power of Suppliers
5.4.5. Industry Rivalry
5.5. Value Chain & Critical Path Analysis
5.6. Pricing Analysis
5.7. Technology Analysis
5.8. Patent Analysis
5.9. Trade Analysis
5.10. Regulatory Framework Analysis
6. Radiation-Hardened Electronics Market, by Component
6.1. Introduction
6.2. Application Specific Integrated Circuit
6.3. Field Programmable Gate Arrays
7. Radiation-Hardened Electronics Market, by Manufacturing Technique
7.1. Introduction
7.2. Radiation Hardening by Design
7.3. Radiation Hardening by Process
8. Radiation-Hardened Electronics Market, by Application
8.1. Introduction
8.2. Aerospace & Defense
8.3. Nuclear Power Plant
8.4. Space or Satellite
9. Americas Radiation-Hardened Electronics Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific Radiation-Hardened Electronics Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa Radiation-Hardened Electronics Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. Market Share Analysis, 2023
12.2. FPNV Positioning Matrix, 2023
12.3. Competitive Scenario Analysis
12.3.1. EPC Space Launches First Rad Hard GaN Power Stage IC
12.3.2. Crane A&E Launches New Interpoint xMOR Product Family
12.3.3. Zero-Error Systems Raises USD 7.5 Million for its Radiation-Hardened Semiconductor Integrated Circuits
12.4. Strategy Analysis & Recommendation
13. Competitive Portfolio
13.1. Key Company Profiles
13.2. Key Product Portfolio

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