Flexible Printed Circuit Board Market by Type (Double-sided Flexible Circuits, Multilayer Flexible Circuits, Rigid-flex Circuits), Material (Copper, Liquid Crystal Polymer, Polyester Film), End User - Global Forecast 2024-2030

Flexible Printed Circuit Board Market by Type (Double-sided Flexible Circuits, Multilayer Flexible Circuits, Rigid-flex Circuits), Material (Copper, Liquid Crystal Polymer, Polyester Film), End User - Global Forecast 2024-2030


The Flexible Printed Circuit Board Market size was estimated at USD 23.04 billion in 2023 and expected to reach USD 26.19 billion in 2024, at a CAGR 14.50% to reach USD 59.47 billion by 2030.

The flexible printed circuit board (FPCB) market comprises developing, producing, and selling flexible circuits mounted on flexible plastic substrates, including polyimide, PEEK (Polyether ether ketone), or conductive polyester film. Technological advancements in continuous innovation in electronic components miniaturization positively influence market space. The demand for consumer electronics and the popularity of portable and smart devices has increased the market demand. The growing electronic content in vehicles and inclination towards autonomous driving has enhanced the market growth. However, high initial manufacturing costs and complex fabrication processes are limiting the market scope. The fluctuating raw material costs also impact profitability, creating market growth challenges. Moreover, the development of eco-friendly and sustainable materials is constantly creating opportunities in the market. Integrating FPCBs into next-generation IoT devices also creates potential opportunities in the market.

Regional Insights

In the Americas region, the United States and Canada remain at the forefront of FPCB innovation and consumption. The consumer electronics and military sectors in the Americas region drive demand, with purchasers focusing on high-quality and high-performance products. The initiatives in the Americas often focus on research in improving the recyclability and reducing the environmental footprint of electronic components, with government and private sector investments supporting these endeavors. The EMEA market is sophisticated, with a demand for high-tech, environmentally friendly products. EU regulations such as Restriction of Hazardous Substances (RoHS), influence FPCB designs and materials, are pushing innovation in eco-friendly solutions. European industry stakeholders invest in research and development, as well as sustainability initiatives to drive the market growth. The rising consumer electronics industry in the APAC region has fueled product demand in the region. The rising government emphasis on domestic FPCB production is contributing to the market growth in the APAC region.

Market Insights
  • Market Dynamics

    The market dynamics represent an ever-changing landscape of the Flexible Printed Circuit Board Market by providing actionable insights into factors, including supply and demand levels. Accounting for these factors helps design strategies, make investments, and formulate developments to capitalize on future opportunities. In addition, these factors assist in avoiding potential pitfalls related to political, geographical, technical, social, and economic conditions, highlighting consumer behaviors and influencing manufacturing costs and purchasing decisions.
    • Market Drivers
      • Rising Adoption of Consumer Electronics with the Ongoing Shift Towards Miniature Electronic Devices
      • Increasing Popularity of Compact and Flexible Display Technology in Electronic Products
      • Potential Demand Owing to Increased Reliability by Providing Interconnectivity Solutions
      • Market Restraints
        • Relatively High Cost of flex PCBs Compared to Traditional Rigid PCBs
        • Market Opportunities
          • Technological Advancements in Printed Circuit Boards
          • Proliferating Application of Flexible Electronic Products from Aerospace, Defense, and Automotive
          • Market Challenges
            • Inherent Performance Limitations of Flexible Printed Circuit Board
            • Market Segmentation Analysis
              • Type: Growing popularity of rigid-flex circuits due to its structural rigidity and increased reliability
              • End User: Rising inclination towards electrification and advanced safety features of automotive industry drives adoption of FPCBs
              • Market Disruption Analysis
              • Porter’s Five Forces Analysis
              • Value Chain & Critical Path Analysis
              • Pricing Analysis
              • Technology Analysis
              • Patent Analysis
              • Trade Analysis
              • Regulatory Framework Analysis
              FPNV Positioning Matrix

              The FPNV positioning matrix is essential in evaluating the market positioning of the vendors in the Flexible Printed Circuit Board Market. This matrix offers a comprehensive assessment of vendors, examining critical metrics related to business strategy and product satisfaction. This in-depth assessment empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success, namely Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

              Market Share Analysis

              The market share analysis is a comprehensive tool that provides an insightful and in-depth assessment of the current state of vendors in the Flexible Printed Circuit Board Market. By meticulously comparing and analyzing vendor contributions, companies are offered a greater understanding of their performance and the challenges they face when competing for market share. These contributions include overall revenue, customer base, and other vital metrics. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With these illustrative details, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

              Recent Developments
              • Würth Elektronik launches research project HyPerStripes

                Würth Elektronik introduced the research project HyPerStripes to revolutionize the realm of miniaturized electronics by developing innovative, long, smart, and flexible printed circuit systems. Breaking away from traditional, cumbersome cable wiring, which often impedes innovation due to its cost and material demands, HyPerStripes aims to usher in a new era of high-performance, environmentally friendly electronics. Specifically, the project targets significant advancements in minimally invasive medical devices and sustainable LED lighting solutions. Focusing on roll-to-roll production and integrating electronic components onto extensive, flexible substrates, HyPerStripes proposes enhancing product performance while slashing manufacturing expenses and ecological impacts.

                DuPont Showcases Industry-Leading Innovations in Advanced Circuit Materials and Solutions at TPCA Show 2023 in Taipei

                DuPont Electronics & Industrial has introduced an expansive array of advanced circuit materials catering to the PCB industry. With this offering, DuPont supports the escalation of AI, Machine Learning, and 5G by furnishing innovative metallization chemistries and leveraging machine learning for prompt market delivery. DuPont presents an avant-garde selection of substrate and PCB design solutions, focusing on signal integrity and low-loss transmission.

                New material for 6G flexible printed circuit boards

                Panasonic Industry with its Copper Clad Stretch (CCS) technology is redefining the landscape of flexible printed circuit boards (FPCBs) with its ability to stretch contrasting sharply with traditional rigid copper clad laminates (CCLs). The CCS incorporates a resin system within the circuit layer and overlay that supports dynamic applications by enabling flexibility beyond conventional materials.
              Strategy Analysis & Recommendation

              The strategic analysis is essential for organizations seeking a solid foothold in the global marketplace. Companies are better positioned to make informed decisions that align with their long-term aspirations by thoroughly evaluating their current standing in the Flexible Printed Circuit Board Market. This critical assessment involves a thorough analysis of the organization’s resources, capabilities, and overall performance to identify its core strengths and areas for improvement.

              Key Company Profiles

              The report delves into recent significant developments in the Flexible Printed Circuit Board Market, highlighting leading vendors and their innovative profiles. These include Abis Circuits Co., Ltd., AirBorn, Inc., Alper S.R.L., Amphenol Corporation, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, BHflex Co., Ltd., ES&S Solutions GmbH, Eurocircuits GmbH, ExPlus Co., Ltd., Fralock Holdings, LLC, Fujikura Ltd., Ichia Technologies Inc., Interplex Holdings Pte. Ltd., Jinghongyi PCB (HK) Co., Limited, Mekoprint A/S, Multek Corporation, Nitto Denko Corporation, NOK Corporation, RayMing, Schweizer Electronic AG, Shenzhen Kinwong Electronic Co., Ltd., Sumitomo Electric Industries Ltd., Tech Etch, Inc., Tianjin Printronics Circuit Corp., TTM Technologies, Inc., Unimicron Technology Corporation by United Microelectronics Corporation, Würth Elektronik eiSos GmbH & Co. KG, and Zhen Ding Tech. Group Technology Holding Limited.

              Market Segmentation & Coverage

              This research report categorizes the Flexible Printed Circuit Board Market to forecast the revenues and analyze trends in each of the following sub-markets:
              • Type
                • Double-sided Flexible Circuits
                • Multilayer Flexible Circuits
                • Rigid-flex Circuits
                • Sculptured Flexible Circuits
                • Single-sided Flexible Circuits
                • Material
                  • Copper
                  • Liquid Crystal Polymer
                  • Polyester Film
                  • Polyimide Film
                  • End User
                    • Automotive Electronics
                    • Consumer Electronics & Wearables
                    • Defense & Aerospace
                    • Healthcare
                    • Lighting
                    • Military
                    • Telecommunications
                    • Region
                      • Americas
                        • Argentina
                        • Brazil
                        • Canada
                        • Mexico
                        • United States
                          • California
                          • Florida
                          • Illinois
                          • New York
                          • Ohio
                          • Pennsylvania
                          • Texas
                          • Asia-Pacific
                            • Australia
                            • China
                            • India
                            • Indonesia
                            • Japan
                            • Malaysia
                            • Philippines
                            • Singapore
                            • South Korea
                            • Taiwan
                            • Thailand
                            • Vietnam
                            • Europe, Middle East & Africa
                              • Denmark
                              • Egypt
                              • Finland
                              • France
                              • Germany
                              • Israel
                              • Italy
                              • Netherlands
                              • Nigeria
                              • Norway
                              • Poland
                              • Qatar
                              • Russia
                              • Saudi Arabia
                              • South Africa
                              • Spain
                              • Sweden
                              • Switzerland
                              • Turkey
                              • United Arab Emirates
                              • United Kingdom


                              Please Note: PDF & Excel + Online Access - 1 Year


1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Rising Adoption of Consumer Electronics with the Ongoing Shift Towards Miniature Electronic Devices
5.1.1.2. Increasing Popularity of Compact and Flexible Display Technology in Electronic Products
5.1.1.3. Potential Demand Owing to Increased Reliability by Providing Interconnectivity Solutions
5.1.2. Restraints
5.1.2.1. Relatively High Cost of flex PCBs Compared to Traditional Rigid PCBs
5.1.3. Opportunities
5.1.3.1. Technological Advancements in Printed Circuit Boards
5.1.3.2. Proliferating Application of Flexible Electronic Products from Aerospace, Defense, and Automotive
5.1.4. Challenges
5.1.4.1. Inherent Performance Limitations of Flexible Printed Circuit Board
5.2. Market Segmentation Analysis
5.2.1. Type: Growing popularity of rigid-flex circuits due to its structural rigidity and increased reliability
5.2.2. End User: Rising inclination towards electrification and advanced safety features of automotive industry drives adoption of FPCBs
5.3. Market Disruption Analysis
5.4. Porter’s Five Forces Analysis
5.4.1. Threat of New Entrants
5.4.2. Threat of Substitutes
5.4.3. Bargaining Power of Customers
5.4.4. Bargaining Power of Suppliers
5.4.5. Industry Rivalry
5.5. Value Chain & Critical Path Analysis
5.6. Pricing Analysis
5.7. Patent Analysis
5.8. Trade Analysis
5.9. Regulatory Framework Analysis
5.10. Client Customization
6. Flexible Printed Circuit Board Market, by Type
6.1. Introduction
6.2. Double-sided Flexible Circuits
6.3. Multilayer Flexible Circuits
6.4. Rigid-flex Circuits
6.5. Sculptured Flexible Circuits
6.6. Single-sided Flexible Circuits
7. Flexible Printed Circuit Board Market, by Material
7.1. Introduction
7.2. Copper
7.3. Liquid Crystal Polymer
7.4. Polyester Film
7.5. Polyimide Film
8. Flexible Printed Circuit Board Market, by End User
8.1. Introduction
8.2. Automotive Electronics
8.3. Consumer Electronics & Wearables
8.4. Defense & Aerospace
8.5. Healthcare
8.6. Lighting
8.7. Military
8.8. Telecommunications
9. Americas Flexible Printed Circuit Board Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific Flexible Printed Circuit Board Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa Flexible Printed Circuit Board Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. Market Share Analysis, 2023
12.2. FPNV Positioning Matrix, 2023
12.3. Competitive Scenario Analysis
12.3.1. Würth Elektronik launches research project HyPerStripes
12.3.2. DuPont Showcases Industry-Leading Innovations in Advanced Circuit Materials and Solutions at TPCA Show 2023 in Taipei
12.3.3. New material for 6G flexible printed circuit boards
12.4. Strategy Analysis & Recommendation
13. Competitive Portfolio
13.1. Key Company Profiles
13.2. Key Product Portfolio

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