Electronic Adhesives Market by Materials (Acrylics, Epoxies, Polyurethanes), Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, Ultraviolet Curing), Application, End User - Global Forecast 2024-2030
Electronic Adhesives Market by Materials (Acrylics, Epoxies, Polyurethanes), Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, Ultraviolet Curing), Application, End User - Global Forecast 2024-2030
The Electronic Adhesives Market size was estimated at USD 6.01 billion in 2023 and expected to reach USD 6.45 billion in 2024, at a CAGR 7.30% to reach USD 9.86 billion by 2030.
Electronic adhesives refer to specialized materials used to bond electronic components and assemblies. These adhesives offer high-performance bonding solutions essential for the miniaturization and integration of electronic devices. They are designed to provide reliable electrical, thermal, and mechanical properties, meeting the stringent requirements of the electronics industry. Meanwhile, the increasing need for electronics manufacturing and miniaturization bolsters the demand for electronic adhesives. However, the concerns associated with the fluctuation in the prices of raw materials and strict government regulations present a significant challenge for the manufacturers. Companies frequently work towards boosting their supply chain channel and introducing an innovative adhesive to remain agile within the global spaces. Moreover, the advancements in developing electronic adhesives such as UV curable and cyanoacrylate adhesives are advances for the manufacturers and present a significant opportunity to extend their businesses further in the evolving landscape.
Regional Insights
The Americas, particularly the United States and Canada, holds a significant position in electronic adhesives due to its robust electronics manufacturing sector and penchant for high-performance materials. Innovations in this region are driving the landscape of electronic adhesives with advanced solutions for thermal management and improved conductive properties. Consumer demand in this region is rigorously defined by high-quality standards and environmental concerns, leading to an increased adoption of eco-friendly adhesives. Additionally, investment in research and development in the United States is substantial, leading to cutting-edge patents in adhesive technologies that enhance device miniaturization and flexible electronics. On the other hand, the electronic adhesives market in Europe and the Middle East is experiencing notable growth, driven by the expanding electronics industry and the ongoing technological advancements in these regions. Europe, with its major capabilities in automotive and advanced manufacturing industries, exhibits significant demand for electronic adhesives that offer reliability and durability under harsh conditions. The Middle East presents a growing market with potential for expansion, primarily due to the diversification efforts of economies beyond the oil sector and the rise in electronic manufacturing and repair services. Moreover, the Asia Pacific region has experienced robust growth and is projected to continue its upward trajectory, characterized by the increasing demand for consumer electronics, the expansion of the semiconductor industry, and the rise in applications across various sectors, including automotive, healthcare, and communication. The rapid technological advancements and the integration of electronics in the automotive and transportation sectors drive the need for more durable and efficient adhesives in this region.
Market Insights
Market Dynamics
The market dynamics represent an ever-changing landscape of the Electronic Adhesives Market by providing actionable insights into factors, including supply and demand levels. Accounting for these factors helps design strategies, make investments, and formulate developments to capitalize on future opportunities. In addition, these factors assist in avoiding potential pitfalls related to political, geographical, technical, social, and economic conditions, highlighting consumer behaviors and influencing manufacturing costs and purchasing decisions.
Market Drivers
Growth in Electronics Application to Increase Electronic Assembly Productivity
Growing Need for Miniaturized Electronic Products
Rising Demand Owing to the Introduction of 5G Network
Market Restraints
Fluctuation in the Prices of Raw Materials
Market Opportunities
Advancements and Developments in Medical Devices Such as the Application of UV Curable and Cyanoacrylate Adhesives
Growing Adoption of Electronic Adhesives in Electric Vehicles
Market Challenges
Environmental Impact of Electronic Adhesives
Market Segmentation Analysis
Materials: Utilization of acrylics and polyurethanes in electronics manufacturing offering strong bonding capabilities and thermal conductivity
Product Type: Preference for thermally condustive and ultraviolet curing adhesives to cater a harsh environments conditions
Application: Extensive applications of electronic adhesives in semiconductor and household electronic manufacturing
End User: Increasing uses of electronic adhesives in varied industries providing excellent insulation and biocompatibility
Market Disruption Analysis
Porter’s Five Forces Analysis
Value Chain & Critical Path Analysis
Pricing Analysis
Technology Analysis
Patent Analysis
Trade Analysis
Regulatory Framework Analysis
FPNV Positioning Matrix
The FPNV positioning matrix is essential in evaluating the market positioning of the vendors in the Electronic Adhesives Market. This matrix offers a comprehensive assessment of vendors, examining critical metrics related to business strategy and product satisfaction. This in-depth assessment empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success, namely Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The market share analysis is a comprehensive tool that provides an insightful and in-depth assessment of the current state of vendors in the Electronic Adhesives Market. By meticulously comparing and analyzing vendor contributions, companies are offered a greater understanding of their performance and the challenges they face when competing for market share. These contributions include overall revenue, customer base, and other vital metrics. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With these illustrative details, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Recent Developments
Bodo Möller and Henkel Expand Partnership to Improve Thermal Interface Materials
Bodo Möller Chemie Group and Henkel Adhesive Technologies partnered to include the Swiss market, focusing on Thermal Interface Materials (TIMs), a critical component in thermal management. Henkel's esteemed Bergquist materials have been at the forefront, engineered to transfer heat away from power electronics effectively. Additionally, TIMs serve to rectify surface irregularities, thus minimizing thermal resistance and significantly improving heat dispersion.
Arkema Acquires Polytec PT, Specialized in Adhesives for Batteries and Electronics
Arkema announced its acquisition of Polytec PT, a company renowned for its specialization in adhesives applied in these domains. Integrating Polytec PT under Arkema's Bostik umbrella enhances the latter's portfolio, positioning the Group as a comprehensive systems provider capable of championing sustainable solutions within these dynamic markets. This acquisition's synergy expands Bostik's engineering adhesive range and underscores Arkema's commitment to delivering innovative, high-performance adhesive technologies.
Master Bond Introduces Epoxy for Sealing Applications
Master Bond Inc. unveiled its latest innovation in epoxy systems, the Master Bond Supreme 3HTND-2DM. This robust, single-component epoxy delivers a rapid cure for efficient processing. Supreme 3HTND-2DM is specially tailored for the dam-and-fill technique, offering a viable alternative to traditional glob top solutions. Ideal for safeguarding chips and their sensitive wire connections, Supreme 3HTND-2DM harmonizes production efficacy with performance excellence, presenting a sophisticated encapsulant that adheres to the strict quality standards of modern electronic manufacturing.
Strategy Analysis & Recommendation
The strategic analysis is essential for organizations seeking a solid foothold in the global marketplace. Companies are better positioned to make informed decisions that align with their long-term aspirations by thoroughly evaluating their current standing in the Electronic Adhesives Market. This critical assessment involves a thorough analysis of the organization’s resources, capabilities, and overall performance to identify its core strengths and areas for improvement.
Key Company Profiles
The report delves into recent significant developments in the Electronic Adhesives Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Arkema SA, Avery Dennison Corporation, BASF SE, Delo Adhesives, Dow Chemical Company, Dymax Corporation, Element Solutions Inc., Ellsworth Adhesives, Evonik Industries AG, Glue Dots International, H.B. Fuller Company, Henkel AG & Co. KGaA, Huntsman International LLC, Indium Corporation, LG Chemical Ltd., Master Bond Inc., Meridian Adhesives Group, Mitsui Chemicals, Inc., Panacol-Elosol GmbH, Parker Hannifin Corporation, Permabond LLC, PPG Industries, Inc., Shenzhen DeepMaterial Technologies Co., Ltd., Sika AG, Tesa SE, ThreeBond Holdings Co., Ltd., Toray Industries, Inc., Wacker Chemie AG, and Xiamen Weldbond New Material Co., Ltd.
Market Segmentation & Coverage
This research report categorizes the Electronic Adhesives Market to forecast the revenues and analyze trends in each of the following sub-markets:
Materials
Acrylics
Epoxies
Polyurethanes
Silicones
Product Type
Electrically Conductive Adhesives
Thermally Conductive Adhesives
Ultraviolet Curing
Application
Conformal Coating
Encapsulation
Surface Mounting
End User
Aerospace Electronics
Automotive Electronics
Desktops & Networks Devices
Home Appliances
Industrial Analytical & Measurement Instruments
Medical Devices
Mobiles & Telecommunication Devices
Region
Americas
Argentina
Brazil
Canada
Mexico
United States
California
Florida
Illinois
New York
Ohio
Pennsylvania
Texas
Asia-Pacific
Australia
China
India
Indonesia
Japan
Malaysia
Philippines
Singapore
South Korea
Taiwan
Thailand
Vietnam
Europe, Middle East & Africa
Denmark
Egypt
Finland
France
Germany
Israel
Italy
Netherlands
Nigeria
Norway
Poland
Qatar
Russia
Saudi Arabia
South Africa
Spain
Sweden
Switzerland
Turkey
United Arab Emirates
United Kingdom
Please Note: PDF & Excel + Online Access - 1 Year
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Growth in Electronics Application to Increase Electronic Assembly Productivity
5.1.1.2. Growing Need for Miniaturized Electronic Products
5.1.1.3. Rising Demand Owing to the Introduction of 5G Network
5.1.2. Restraints
5.1.2.1. Fluctuation in the Prices of Raw Materials
5.1.3. Opportunities
5.1.3.1. Advancements and Developments in Medical Devices Such as the Application of UV Curable and Cyanoacrylate Adhesives
5.1.3.2. Growing Adoption of Electronic Adhesives in Electric Vehicles
5.1.4. Challenges
5.1.4.1. Environmental Impact of Electronic Adhesives
5.2. Market Segmentation Analysis
5.2.1. Materials: Utilization of acrylics and polyurethanes in electronics manufacturing offering strong bonding capabilities and thermal conductivity
5.2.2. Product Type: Preference for thermally condustive and ultraviolet curing adhesives to cater a harsh environments conditions
5.2.3. Application: Extensive applications of electronic adhesives in semiconductor and household electronic manufacturing
5.2.4. End User: Increasing uses of electronic adhesives in varied industries providing excellent insulation and biocompatibility